In an unexpected move, the main casters of semiconductors of the world decided to ally in a joint R & D project. It represents an investment of $ 4.4 billion, of which 3.6 billion made only by IBM.
All of the research will be conducted in facilities located in the State of New York, to the United States, where IBM, Intel and Global Foundries already own factories. Total 2500 high-tech jobs (1900 positions for the construction of buildings) will be created. The investment will be used two different projects. The first, involving IBM, Samsung and Global Foundries, aims to develop the next two generations of chips, 14 nm and 22 nm. Recall that Intel has a step ahead of them and already produced chips in 22 nm "3D".
The second project, bringing together five casters, will study the update of engraving plants for use with wafers of 45 cm in diameter. The majority of the industry today uses wafers of 30 cm in diameter. The transition to 45 cm would double the amount of chips per wafer.
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