TSMC is indeed preparing the transition to 450 mm wafers to...
End of 2010, we talking already the possibility of a passage to wafers of 450 mm (18 ") by some skiers (including Intel) and we detail that compatible foundries did not open their doors before 2018 in the best of cases. Finally, we learn that TSMC would be able to put as soon as 2015.
Information confirmed by the Taiwanese fondeur which, starting next year, will begin to assess compatible tools that provide its partners. As early as 2013, first production tests should be conducted in the TSMC Fab 12 on a process of etching 20 nm. The Fab 14 it also host these new tools in 2014 and Fab 15 currently in construction on tools for the 300 mm wafers will see some of its lines be converted for 450 mm wafer.
It is in this Fab 15 that TSMC expects to launch in 2015, the engraving of 14 nm processors. And if all goes well, in 2015/2016, TSMC will establish a new plant, entirely dedicated to 450 mm.
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